The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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As a further challenge, laser cutting and structuring processes are developed for substrate separation and interconnection. Approaches for the further substantial increase of the throughput should be developed with respect to the equipment. In addition, micromca has a fully equipped application laboratory with experienced process engineers to support customers in feasibility tests, process development, and realization of customized solutions.

Excellent Support and Service.

microPREP – Laser Micromachining – 3D-Micromac AG

This project has received funding from the Federal Ministry of Education and Research under grant agreement no [16ES]. Its high throughput, outstanding edge quality and mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices. The work is supported by five academic institute partners.

The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches. Our expertise and engineering competency allow us to stand alongside our customers as reliable partners in technology and process development as well as in the development of OEM-manufacturing solutions and customer-specific systems.

At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add more functionality on devices within a smaller footprint. Our products help increase production efficiency, optimize processes and lower costs in various areas of technology.


3D-Micromac Celebrates 15 Years, Opens New Building

Target of this project is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications. As microomac result of the project, demonstrators are being developed that illustrate the power of the technology.

With that we have established a strong foundation for dynamic growth in international markets. Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. We are one of the first companies mocromac the world to focus on the use of ultra-short pulse lasers for the processing of materials.

Microma aim is to provide superb customer satisfaction even for the most complex projects. Microdiagnostics and Failure Analysis. Innovative laser processes are revolutionizing industrial manufacturing worldwide. The electrical and mechanical properties of the cells after cutting are in the focus of the investigations. Thereto the project part of 3D-Micromac will provide an important contribution: From the founding of our company until today we have constantly been able to achieve important milestones: This is particularly true for silicon carbide SiC substrates, which are hard and brittle.

The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies. They are characterized by extraordinary reliability and productivity, fine precision, and flexibility. Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan.

Although lasers are well established tools in manifold applications, they have been broadly ignored for use in sample preparation due to concerns regarding their potential for causing structural damage. These platforms are open to multiple users and for multiple applications. The system features 3dd line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near infrared, green and ultravioletresulting in a highly flexible, high-quality laser annealing platform.


We Optimize your Processes! The different processing methods that are realized with our laser systems include micro drilling, signing, cutting, 2D and 3D micgomac, welding as well as marking of different materials and thin films.

More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.

Markets – Laser Micromachining – 3D-Micromac AG

Those properties should be unchanged after cutting. Therefore, we are very proud to be certified to the ISO quality standard since Opening of the company headquarters at the Chemnitz Technology Campus The microPREP micomac an be used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics.

The contactless cell handling enables processing without surface defects and microcracks. The project will also support European analytical equipment providers, many of them SME, to explore new market opportunities, design new equipment, and to align their developments to future needs of new system integration technologies.

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