STM and JESDAF respectively. A typical Human Body Model circuit is presented in Figure 1. Figure 1: Typical Human Body Model Circuit. In September , a small group of ESD control and design stakeholders assembled in a Read More». In the EERC Resource Center. A Dash of Maxwell’s. JESDAF. – IEC (C= pF). – MIL method Pulse parameters. HBM. Reference voltage. 2KV 4KV. Peak current. A A.
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The actual number of pin combination sets depends on the number of power pin groups. Attach a shorting wire between these pins with the current probe around the shorting wire, as close to Terminal B as practicable.
NOTE 2 To determine if a 1a14f to be tested is susceptible to damage from the trailing pulse it may be necessary to measure the voltage across the actual device during HBM testing, or a circuit similar to that in Figure 4.
Power pins and Power Pin Groups are defined in 4. Any pin that is intended ejsd22 supply power to another circuit on the same chip must be treated as a power pin. Included pins connected to charge pump capacitors as power pins.
NOTE 2 To determine if a device to be tested is susceptible to damage from the trailing pulse it may be necessary to measure the voltage across the actual device during HBM testing, or a circuit similar to that in Figure 4. NOTE 3 R2, used for initial equipment qualification and requalification as specified in 3. All pins one at time to Vdd3 power pin group 6.
This test will check for any open or short relays. Deformation of water surface.
Additionally, all personnel shall receive system operational training and electrical safety training prior to using the equipment.
All pins one at time to Vdd1 power pin group 5.
If testing is required at multiple temperatures, testing shall be performed at the lowest temperature first. This may require additional testing as each nonsupply pin must be treated as an individual power pin group. The measured voltage and the time that it is present on the device can then be compared to the known reliability mechanisms of the technology, such as time dependent dielectric breakdown TDDBto determine if a reliability concern is posed by the HBM tester.
JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and hesd22 the x114f in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. The probe transformer and cable with a nominal length of 1 meter shall have a 1 GHz bandwidth, a minimum current rating of 12 amperes peak pulse-current capability and a rise time of less than one nanosecond.
The period between waveform checks may be extended providing test data supports the increased interval.
Finer voltage steps may optionally be used to obtain a more accurate measure of the failure threshold. Apply a positive and negative V pulse and verify the waveform a114f the requirements defined in Table 1. Connect this pin to Terminal B where it will remain the referenced pin throughout the worst-case pin search and connect one of the remaining pins to Terminal A.
For printed directions jssd22 Preparing for Registration. ESD testing should begin at the lowest step in Table 1 but may begin at any level. Finer voltage steps may optionally be used to a1114f a more accurate measure of the failure threshold. The measured voltage and the time that it is present on the device can then be compared to the known reliability mechanisms of the technology, such as time dependent dielectric breakdown TDDBto determine if a jesf22 concern is posed by the HBM tester.
The tester-dependent voltage rise was observed to alter the timing of the protection action. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. Reduced minimum interval between zaps to milliseconds.
jesdaf | In Compliance Magazine
Each non-supply pin to all other non-supply pin; all power pins left unconnected. To provide better data reproducibility, it is permitted to place a shunt resistance between the pin to be stressed Terminal A and the system ground Terminal B in order to quench the pre-pulse phenomenon and eliminate the voltage rise as long as it does not alter the HBM waveforms as specified in Table 1 in tester qualification, calibration and waveform verification.
This tester issue was found to divert significant current away from the pins mesd22 to Terminal B, such that the slew-rate of the current at terminal B is lower than seen at Terminal A.
If the Supply pins are connected on package plane clause 4. Otherwise each power pin must be treated as a separate power pin.
This issue may impact slew rate triggered ESD protection methods on higher pin count packages. It is permitted to use a separate sample of 3 devices for each pin combination set specified in Table 2.
ESD Tests | Reliability Technology Division | Services | OKI Engineering
I recommend changes to the following: All pins one at time to Gnd2 power pin group 3. All pins one at time to Gnd1 power pin group 2. Machine repeatability should be verified during initial equipment acceptance by performing a minimum of 5 consecutive a114r and a minimum of 5 consecutive negative waveforms at a voltage level in Table 2. Connect this pin to Terminal B where it will remain the referenced pin throughout the worst-case pin search and connect one of the remaining pins to Terminal A.
Connect this pin to Terminal B and then connect the socket pin with the longest wiring path from the pulse generating circuit to the test socket to Terminal A normally provided by the manufacturer. Jessd22 recommend changes to the following: This issue may impact slew rate triggered ESD protection methods on higher pin count packages. When replacing only a single polarity of a given combination, the opposite polarity shall be used when adopting this reverse pin combination alternative.